These cookies are required for the website to run and cannot be switched off. Such cookie are only set in response to actions made by you such as language, currency, login session, privacy preferences. You can set your browser to block these cookies but our site may not work then.
Analytics and Statistics
These cookies allow us to measure visitors traffic and see traffic sources by collecting information in data sets. They also help us understand which products and actions are more popular than others.
Marketing and Retargeting
These cookies are usually set by our marketing and advertising partners. They may be used by them to build a profile of your interest and later show you relevant ads. If you do not allow these cookies you will not experience targeted ads for your interests.
This website uses cookies to ensure you get the best experience on our website.
Learn more
331 second and third level + processing unit interchanging socket to compose another central based chip socket with alternate sub levels of chip sockets. generally considered non central or additional..
762 low level back pack air cleaner and ventilator generators that catch air and control the pollutants and then exhaust with a generation of expended and recycled energy and new clean air for valley ..
1182 single level chip platform print and stack conductors that match a sphere and link like a socket and drive copyright (c) 2017 christopher gabriel brown patent christopher g brown 2380 capture118..
1183 multiple level chip assembly to print and stack construction chips in a link and exchange processing manner copyright (c) 2017 christopher gabriel brown patent christopher g brown 2379 capture11..
1184 software written multiple level chip assembly to print and stack construction chips in a link and exchange processing manner by cubit cell and cubit grid copyright (c) 2017 christopher gabriel br..
1189 additional socket and secondary level chips of a software written multiple level chip assembly to print and stack construction chips in a link and exchange processing manner by cubit cell and cub..
1280 in a insulated chip levels made from of with a coherence of any insulation method of stacking horizontal or vertical chip organization to build a larger chip also said as to make a non conductive..
1281 in a insulated chip levels with a coherence of any insulation method of stacking horizontal or vertical chip organization to build a larger chip also said as to make a non conductive layer with s..
1282 cube processors in a insulated chip levels with a coherence of any insulation method of stacking horizontal or vertical chip organization to build a larger chip also said as to make a non conduct..
1356 tiered leveled sequential multiple free functional add-ons are the additional scaleable plug and play options of any such freely to place in a location to import processing and to increase a prob..
1363 upgrade able secondary level chips that co process in an onboard secondary socket that incorporate alternate processing like the central chip but in a on board or in socket form of non graphic no..
1364 upgrade able secondary level random access memory that store in an onboard secondary group of sockets that incorporate alternate processing like the first level ram but in a off or on board or in..
1599 laser printed levels of circuits and multiple cured solvents as circuits layers laser printed chips in a diffused solution to compute as a chip (c) copyright christopher gabriel brown 2019 paten..
1600 ultra violet laser printed levels of circuits and multiple uv cured solvents as circuits layers laser printed chips in a diffused solution to compute as a chip (c) copyright christopher gabriel b..
1601 laser printed levels of circuits and multiple photo sensitive cured solvents as circuits layers laser printed chips in a diffused solution to compute as a chip (c) copyright christopher gabriel b..
1602 perpendicular laser printed levels of circuits processors and memory in multiple photo sensitive cured solvents as circuits layers laser printed chips in a diffused solution to compute as a chip ..
1663 insulated chip levels made from of with a coherence of any insulation method of stacking horizontal or vertical chip organization to build a larger chip also said as to make a non conductive laye..